NVIDIA is hiring a Package Layout Engineer in Bengaluru to help implement high-speed, high-density ASIC packages for its GPUs and SoCs. Working in a layout team, you will create substrate breakout patterns, optimise package pinouts with system-level trade-offs, and handle routing, placement, stack-up, reference planes and power distribution using Cadence APD or SiP tools. You will propose layout trade-offs to the technical package lead, run feasibility studies on size, cost and performance, build symbols and CAD library databases, and improve layout methods. Candidates need a B.S. in Electrical Engineering or equivalent and 3+ years of PCB layout experience on graphics cards, motherboards, line cards or similar; HDI design experience is a plus.