Intel's Assembly and Test Technology Development group is hiring a Silicon Packaging Design Engineer in Bengaluru. You will work on the end-to-end development of advanced substrate designs, running substrate fit and routing studies to balance performance, cost and manufacturability, and working with customers and internal teams so that packaging solutions meet electrical and manufacturing requirements.
Requirements: a bachelor's degree in Electrical, Electronics or Computer Engineering or a related STEM field with 1 to 6 years of hands-on silicon packaging design experience (projects, internships or coursework count), or a master's degree with no prior experience. Skills with EDA tools such as Cadence or Siemens for package/PCB design, scripting in Python, Perl or SKILL, Linux, and a strong grasp of electrical field theory are expected.